Fatigue of Solder Interconnects in Microelectronic Assemblies under Random Vibration
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چکیده
منابع مشابه
ABSTRACT Title of Dissertation: HARMONIC AND RANDOM VIBRATION DURABILITY INVESTIGATION FOR SAC305 (Sn3.0Ag0.5Cu) SOLDER INTERCONNECTS
Title of Dissertation: HARMONIC AND RANDOM VIBRATION DURABILITY INVESTIGATION FOR SAC305 (Sn3.0Ag0.5Cu) SOLDER INTERCONNECTS Yuxun Zhou, Doctor of Philosophy, 2008 Dissertation directed by: Professor Abhijit Dasgupta Department of Mechanical Engineering Vibration loading is commonly encountered during the service life of electronic products. However, compared to thermal cycling durability, vibr...
متن کاملAnalyzing Random Vibration Fatigue
Determining the fatigue life of parts under periodic, sinusoidal vibration is a fairly straightforward process in which damage content is calculated by multiplying the stress amplitude of each cycle from harmonic analysis with the number of cycles that the parts experience in the field. The computation is relatively simple because the absolute value of the vibration is highly predictable at any...
متن کاملTesting Power and Microelectronic Interconnects
Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...
متن کاملReliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique
Solder joints in microelectronic are used for electrical signals transmission, heat conduction and structural support. One of the key problems referring to solders in microelectronics is reliability due to typical failure modes as creep and fatigue. The above paper focuses on the experimental measurements and corresponding analysis with the microindentation tests of the SAC 405 solder alloy due...
متن کاملTesting Power and Microelectronic Interconnects
Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...
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ژورنال
عنوان ژورنال: Procedia Engineering
سال: 2014
ISSN: 1877-7058
DOI: 10.1016/j.proeng.2014.06.243